Sirectifier Global Corp. (SGC), located in Delaware, U.S.A., is a leading designer and ODM/OEM service provider in the power semiconductor field. It was founded in 1987 and its major products include Power Discrete and Power Module Devices (Diodes, Schottky, MOSFETs, SCRs, Transistors, IGBTs, Thyristors and ESD Protection Devices) for the industrial, consumer, computer, telecommunication and automotive applications. It is a global joint venture group, with facilities located in America, Europe and Asia, which function as design centers, manufacturing plants, marketing and sales offices.

Based in Delaware, U.S.A., the research and design company partnered with several global semiconductor suppliers of semiconductor components with the aim of developing high-density and efficient power devices, and the team-up has generated a dynamic synergy that resulted in several new advancements in the assembly process, design, and packaging of power devices suitable for the advanced requirements of today’s every-growing market. The main base of its manufacturing operations is in the Asian region, such as in China and the Philippines, with factories boasting of manufacturing and assembly facilities and wafer FAB lines. The plants have positioned themselves as engineering-driven, product-oriented manufacturers and have assembly and testing process capabilities for various microelectronic packages.

To-date, several new versions of TVS and ESD Protection Devices, Digital Transistors, Trench MOSFETs and Trench IGBT devices, to name a few, have already been designed or are currently under development in our U.S.-based design center. A new, compact surface mount package, called the Power-pak, has also been jointly developed. The Power-pak package design enables SGC to produce high-power, low thermal resistance, high-average forward rectified current Schottky and Fast Recovery devices in a low and thin outline ideal for miniaturized products such as mobile phones, portable GPS and PDA devices, portable audio, DC-to-DC converters, MP3 players and power management devices.

Recent design breakthroughs have also been achieved with our series of TVS and ESD Protection devices, with TVS array devices packaged into small-footprint surface mount and chip scale packages to give added flexibility to design engineers in miniaturizing devices and maximizing board space and design of portable applications such as mobile handsets, PC-/notebook USB ports, DVI interfaces, monitors and flat panel displays, video graphics cards, SIM ports, ATM interfaces, cordless telephones, wireless data (WAN/LAN) systems, PDAs and HDMI.

Not content in resting on its laurels, the partnership’s research team is even now intent on coming out with more advanced ideas in the power device field to sustain us aggressive steps towards being one of the world’s leaders in power device solutions.

We cordially invite you to contact us and let us help you to find the total solution for your needs.